Use eASIC NEC Microwave Products to Optimize iPASOLINK blender
SANTA CLARA, Calif., April 17, 2014 -. EASIC Corporation, a provider of ASIC devices Adaptive Single Mask , announced that NEC Corporation, a provider of leading solutions for microwave backhaul market, is using Nextreme-2 product eASIC to optimize performance and power key on your connection iPASOLINK functionality.
The microwave backhaul market growing rapidly is becoming more sensitive to energy and at the same time, requires significant increases in performance. NEC is using the benefits of fast response time and low power of the Mask Fits Single ASIC eASIC Nextreme-2 devices to turn quickly differential advantages compared to other providers that use FPGA as the chute for their products in order to achieve high volume with the global launch of LTE.
"Our customers, global operators, constantly need a reduction in the total cost of ownership, higher performance and faster time to deployment of its microwave backhaul solutions," said Mr. Atsushi Noro, Deputy General Manager of the Wireless Solutions Division Phones. "The Single Mask Adaptable eASIC ASIC devices are exactly the technology that enables us to meet the requirements of these operators. Since microwave blender units are becoming smaller, NEC can reduce total cost of ownership for operators through the benefits of significant energy eASIC devices, "said Noro.
"The microwave blender is another free market custom silicone demand. The rapid growth in mobile devices has created a huge demand for next-generation backhaul links to support bitrates constantly increasing, at the same time reduce the cost of ownership and energy, "said Ronnie Vasishta, President and CEO of eASIC Corporation . "We are excited blender to be shipping products to meet NEC and NEC attending our function to achieve your goals higher system performance and energy reduction, since FPGA can not fulfill these essential requirements," Vasishta said.
eASIC is a fabless semiconductor company offering revolutionary Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time to the production of customized semiconductor devices. Through a patented technology that uses the custom routing layer designs low cost, high performance and fast ASIC and system-on-chip (System-on-Chip, SOC) are activated. This innovative production allows eASIC offer a new generation of application specific integrated circuits (Application Specific Integrated Circuit, ASIC) with significantly lower than those of traditional ASIC initial costs. blender
eASIC Corporation, which is unlisted, is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC visit www.easic.com.
Recent blender Posts TA Associates announces majority investment in Bomgar Mavenir Systems Launches Customer Solution for Voice Messaging and Mobile UltraFlix is positioned in the 4K Smart TV App "Go-To" 4K TV ADLINK selects Gemalto to accelerate M2M cloud services will grow in investments European telcos OQM system installed wastewater recycling in Queretaro Turkey moves towards the digital economy model management simulator "Fishbanks" is available in Spanish and Faxitron Devicor blender Medical Products Announce Alliance blender Sales Director at Alstom in Brazil K2 Management joins Meta Register Log in Entries RSS Comments RSS WordPress.org [Un] Subscribe to Posts Archives May 2014 April 2014 March 2014 February 2014 January 2014 December blender 2013 November 2013 October blender 2013 September 2013 August 2013 July 2013 June 2013 May 2013 April 2013 March 2013 February 2013 January 2013 December 2012 November 2012 October 2012 September blender 2012 August 2012 July 2012 June 2012 May 2012 April 2012 March 2012 February 2012 January 2012 Categories Select Category ANIXTER / CORNER APPLE / CORNER APPS / WORLD SUCCESS STORY E-GOVERNMENT eBooks EDITORIAL INTERVIEWS GREEN GADGETS IT Infographics INTEL GAMING / CORNER IT / IT APPLICATIONS / CARS IT / CHANNELS IT / IT CONSULTING / ENGINEERING IT / EVENTS IT / IT INFRASTRUCTURE / INNOVATIONS IT / IT JOBs / LEARNING IT / MEDICAL IT / IT PRODUCTS / IT SECURITY / SPECIAL REPORT IT / TRENDS MAGAZINE NETWORKING EVENT PRINTING OUR APPOINTMENTS / SOLUTIONS PRODUCT REVIEW Sinux / CORNER STORAG
SANTA CLARA, Calif., April 17, 2014 -. EASIC Corporation, a provider of ASIC devices Adaptive Single Mask , announced that NEC Corporation, a provider of leading solutions for microwave backhaul market, is using Nextreme-2 product eASIC to optimize performance and power key on your connection iPASOLINK functionality.
The microwave backhaul market growing rapidly is becoming more sensitive to energy and at the same time, requires significant increases in performance. NEC is using the benefits of fast response time and low power of the Mask Fits Single ASIC eASIC Nextreme-2 devices to turn quickly differential advantages compared to other providers that use FPGA as the chute for their products in order to achieve high volume with the global launch of LTE.
"Our customers, global operators, constantly need a reduction in the total cost of ownership, higher performance and faster time to deployment of its microwave backhaul solutions," said Mr. Atsushi Noro, Deputy General Manager of the Wireless Solutions Division Phones. "The Single Mask Adaptable eASIC ASIC devices are exactly the technology that enables us to meet the requirements of these operators. Since microwave blender units are becoming smaller, NEC can reduce total cost of ownership for operators through the benefits of significant energy eASIC devices, "said Noro.
"The microwave blender is another free market custom silicone demand. The rapid growth in mobile devices has created a huge demand for next-generation backhaul links to support bitrates constantly increasing, at the same time reduce the cost of ownership and energy, "said Ronnie Vasishta, President and CEO of eASIC Corporation . "We are excited blender to be shipping products to meet NEC and NEC attending our function to achieve your goals higher system performance and energy reduction, since FPGA can not fulfill these essential requirements," Vasishta said.
eASIC is a fabless semiconductor company offering revolutionary Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time to the production of customized semiconductor devices. Through a patented technology that uses the custom routing layer designs low cost, high performance and fast ASIC and system-on-chip (System-on-Chip, SOC) are activated. This innovative production allows eASIC offer a new generation of application specific integrated circuits (Application Specific Integrated Circuit, ASIC) with significantly lower than those of traditional ASIC initial costs. blender
eASIC Corporation, which is unlisted, is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC visit www.easic.com.
Recent blender Posts TA Associates announces majority investment in Bomgar Mavenir Systems Launches Customer Solution for Voice Messaging and Mobile UltraFlix is positioned in the 4K Smart TV App "Go-To" 4K TV ADLINK selects Gemalto to accelerate M2M cloud services will grow in investments European telcos OQM system installed wastewater recycling in Queretaro Turkey moves towards the digital economy model management simulator "Fishbanks" is available in Spanish and Faxitron Devicor blender Medical Products Announce Alliance blender Sales Director at Alstom in Brazil K2 Management joins Meta Register Log in Entries RSS Comments RSS WordPress.org [Un] Subscribe to Posts Archives May 2014 April 2014 March 2014 February 2014 January 2014 December blender 2013 November 2013 October blender 2013 September 2013 August 2013 July 2013 June 2013 May 2013 April 2013 March 2013 February 2013 January 2013 December 2012 November 2012 October 2012 September blender 2012 August 2012 July 2012 June 2012 May 2012 April 2012 March 2012 February 2012 January 2012 Categories Select Category ANIXTER / CORNER APPLE / CORNER APPS / WORLD SUCCESS STORY E-GOVERNMENT eBooks EDITORIAL INTERVIEWS GREEN GADGETS IT Infographics INTEL GAMING / CORNER IT / IT APPLICATIONS / CARS IT / CHANNELS IT / IT CONSULTING / ENGINEERING IT / EVENTS IT / IT INFRASTRUCTURE / INNOVATIONS IT / IT JOBs / LEARNING IT / MEDICAL IT / IT PRODUCTS / IT SECURITY / SPECIAL REPORT IT / TRENDS MAGAZINE NETWORKING EVENT PRINTING OUR APPOINTMENTS / SOLUTIONS PRODUCT REVIEW Sinux / CORNER STORAG
No comments:
Post a Comment